TEM & STEM Products

PIP II System

Precision ion polishing system for precise centering, control, and reproducibility of your milling process.

Advantages: 

  • X,Y stage permits alignment of argon beams to region of interest on the sample
  • Improved collimated beam provides useable voltages as low as 100 volts for rapid and damage free preparation of FIB lamella
  • Digital optical imaging with image storage and analysis in DigitalMicrograph® software
  • 10" color touch screen for display and control of all PIPS™ II parameters

Dimple Grinder II

Fast and reliable mechanical method of pre-thinning to near electron transparency to greatly reduce your ion milling times and uneven thinning.

Ultrasonic Cutter

Cut your brittle materials beyond the 3 mm transmission electron microscope (TEM) disc to accurately cut holes or unique shapes.